"A Comprehensive Review of Thermal and Mechanical Behavior in Single and Bi-Layer Plates"

Abstract

Cookware appliance thermal and mechanical characteristics are reviewed in this research.
Data on thermal stress, body deformation, heat retention, and temperature distribution (TD)
are compiled numerically. We use the Finite Element Method in the ANSYS software. We
detailed various mechanical and thermal outcomes for Al/Cr-Ni, Al/SSt, Al/Ti, Cu/Cr-Ni,
Cu/SSt, Cu/Ti, GCI, CSt, and iron. The chemical and thermal characteristics of the laminated
plate are better than those of the single-layer counterpart. This study's findings point to the
Cu/SSt bi-metal structure as the superior choice for cookware.